Review
- Introduction
- Packaging and specifications
- Test Bench and Benchmark
- Conclusion
Memory kit packaging are very straightforward.
| SPECIFICATIONS | KHX2133C9BD3T1K2/4GX DDR3 |
| CL(IDD) | 9 cycles |
| Row Cycle Time | (tRCmin) 49.5ns (min.) |
| Refresh to Active/Refresh Command Time (tRFCmin) | 160ns (min.) |
| Row Active Time (tRASmin) | 36ns (min.) |
| Power (Operating) | 0.795 W* (per module) |
| UL Rating | 94 V – 0 |
| Operating Temperature | 0o C to 85o C |
| Storage Temperature | -55o C to +100o C |
*Power will vary depending on the SDRAM used.
• JEDEC: DDR3-1333 CL9-9-9 @1.5V
• XMP Profile #1: D3-1866 CL9-11-9 @1.65V
• XMP Profile #2: D3-2133 CL9-11-10 @1.65V
These memory kits are 61mm tall, so if you have box coolers then these may have clearance issues with it. Due to some motherboard layout, some coolers with push-pull design cover over 2-3 DIMM slots so keep in this in mind before buying it. If you’re buying a CPU water cooling unit or a lot profile CPU heatsink, it will not be an issue. However I think its about time such good memory kits come with low profile heatspreaders. Who knows, maybe 1 fine day everyone will market memory kits with low profile heatspreaders as a feature.
