Memory kit packaging are very straightforward.
|Row Cycle Time||(tRCmin) 49.5ns (min.)|
|Refresh to Active/Refresh Command Time (tRFCmin)||160ns (min.)|
|Row Active Time (tRASmin)||36ns (min.)|
|Power (Operating)||0.795 W* (per module)|
|UL Rating||94 V – 0|
|Operating Temperature||0o C to 85o C|
|Storage Temperature||-55o C to +100o C|
*Power will vary depending on the SDRAM used.
• JEDEC: DDR3-1333 CL9-9-9 @1.5V
• XMP Profile #1: D3-1866 CL9-11-9 @1.65V
• XMP Profile #2: D3-2133 CL9-11-10 @1.65V
These memory kits are 61mm tall, so if you have box coolers then these may have clearance issues with it. Due to some motherboard layout, some coolers with push-pull design cover over 2-3 DIMM slots so keep in this in mind before buying it. If you’re buying a CPU water cooling unit or a lot profile CPU heatsink, it will not be an issue. However I think its about time such good memory kits come with low profile heatspreaders. Who knows, maybe 1 fine day everyone will market memory kits with low profile heatspreaders as a feature.