Well, there was a time (and not too long ago) that memory kits with large heatsinks was something that was pushed forward but a lot of people preferred a low profile, especially since box coolers tend to be an obstacle. Now, a lot of manufacturers emphasize on “low profile” heatsinks.
G skill also says that these come with Intel XMP profile, but also has compatibility with both Intel and AMD platforms. NICE! That’s how I believe memory kits should be.
Taipei-Taiwan – February 8th, 2012: G.Skill, the worldwide leading high-performance memory designer, and manufacturer, has announced the brand new Ares series low profile performance DDR3 memory.
Stylish Low Profile Heat Spreader
Featured with low profile heat spreader design (3.2cm in height), G.Skill Ares series DDR3 memory modules are the perfect choices for building high-performance PCs with large CPU coolers, small form factor desktop computers or any other systems with more restricted space.
The Best Compatibility and Reliability
Every Ares memory kit is hand-tested with G.Skill rigorous internal validation process to ensure the maximum stability and compatibility with both Intel and AMD platforms.
Compliant with the latest Intel XMP (Extreme Memory Profile) function, G.Skill Ares series DDR3 memory provides PC enthusiasts and extreme gamers a trouble free overclocking experience on Intel platforms, while enjoying the enhanced memory bandwidth.
All G.Skill memory products come with a lifetime warranty and the G.Skill technical team is always ready to provide consumers with complete technical support via online forums, telephone, and email.[/showhide]