Intel 9th generation CPUs details are out!

All-new 9th generation Intel CPUs will use 300-series motherboards, mainstream Core i9 series

Intel will be making a couple of changes in the future releases- the addition of Core i9 series for the mainstream desktop platform- and the upcoming 9th generation series CPUs. As of now, each in the Core i9, Core i7 and Core i5 are detailed.

Soldered CPUs? For good, this time?

The new 9th generation Intel Core series are 14nm+++ Whiskey Lake architecture which is expected to be a refreshed Skylake variants. It is speculated that the new generation LGA 1151(v2) CPUs will finally have its integrated heatspreader soldered on the CPU die, therefore ditching the thermal paste application Intel used for so many years since the Haswell days. Many users had to delid the CPU IHS, therefore voiding the warranty just to change the thermal paste inside the CPU for a much better solution. As a result, people enjoyed up to 10 degrees drop. Soldering method, however, ensures far better contact between the surfaces and therefore far better heat dissipation. Intel has been criticized for a very long time for not soldering its CPU IHS.

What we will see is the following:

9th Generation Whiskey Lake Variations

Core 19-9900KCore i7-9700KCore i5-9600K
SocketLGA 1151 V2
Cores/ Threads8/168/86/6
Base Clock3.60 GHz3.60 GHz3.70 GHz
Boost Clock5 GHz4.90 GHz4.60 GHz
L3 Cache16 MB12 MB9 MB
Memory ChannelDual Channel
PCIe Lanes16 Watts
TDP95 Watts

The Core i9-9900K is the flagship with 8 core/16-thread CPU with 16MB L3 cache with base/boost clock of 3.60/5.00 GHz. The i7-9700K is the 8 core/8 thread variation with 3.6/ 4.9GHz base/boost clock speed and Core i5 9600K with six core/six thread 3.7/4.60 GHz clock speeds.

Intel 300-series motherboard compatibility

All use dual-channel memory with 16 PCIe 3.0 lanes with the same 95-watt TDP. All use LGA 1151, and existing 300-series motherboards are compatible with BIOS updates. Pricing of these CPUs are not confirmed, but these CPUs are expected to be out by Q3 2018.

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